Short Bio

Dr. Yu Liu is an Assistant Professor in the Department of Electrical and Computer Engineering at Clarkson University. Prior to joining Clarkson University, he was a research scientist at the Canadian Nuclear Laboratories (CNL) from 2013 through 2017. In addition, he was employed at Motorola as a senior software engineer from 2003 through 2007, and IBM from 2011 through 2013. He received his B.S. and M.S. degrees from Sichuan University in 2000 and 2003, respectively, and his Ph.D. degree from Southern Illinois University Carbondale in 2011. His research interests include high-performance computing, computer architectures, real-time systems, and wireless sensor networks. He has published over 40 peer-reviewed research papers. Also, he has been awarded 4 National Science Foundation (NSF) grants as the co-PI.

Professional Experience

  • Assistant Professor, Clarkson University, August 2017 - Present
  • Research Scientist, Canadian Nuclear Laboratories, September 2013 - August 2017
  • Software Developer, IBM, March 2011 - September 2013
  • Senior Software Engineer & Project Leader, Motorola, July 2003 - August 2007

Education

  • Ph.D., Southern Illinois University Carbondale, 2011
  • M.S., Sichuan University, 2003
  • B.S., Sichuan University, 2000

Research Grants

  • National Science Foundation (NSF) Award #2118079: CyberTraining: Pilot: Employing Proper Orthogonal Decomposition (POD) and High-Performance Computing (HPC) in Advanced CI, Amount: $299,998, September 1, 2021 – August 31, 2023 (Estimated). PIs: Daqing Hou, Ming-Cheng Cheng, Yu Liu
  • National Science Foundation (NSF) Award #2111318: Collaborative Research: Supporting Project-Based Learning in Undergraduate Software Engineering Courses, Amount: $368,630, May 15, 2021 – April 30, 2024 (Estimated). PIs: Daqing Hou, Yu Liu, Jan DeWaters
  • National Science Foundation (NSF) Award #2003307: CDS&E: An Effective Thermal Simulation Methodology for GPGPUs Enabled by Data-Driven Model Reduction, Amount: $375,000, July 1, 2020 – June 30, 2023 (Estimated). PIs: Ming-Cheng Cheng, Yu Liu
  • National Science Foundation (NSF) Award #1852102: REU Site – High Performance Computing with Engineering Applications, Amount: $379,931, February 15, 2019 – January 31, 2023. PIs: Daqing Hou, Yu Liu
  • Clarkson Ignite Research Innovation Fund - COVID-19 Special Solicitation, Analyzing and Mitigating Polarization in Social Media to Fight against COVID-19 Pandemic, Amount: $60,000, July 1, 2020 – June 30, 2022 (Estimated). PIs: Golshan Madraki, Yu Liu, Jeanna Matthews

Current Students

  • Lin Jiang (Ph.D. Student, co-mentored with Prof. Ming-Cheng Cheng), M.S. University of Science and Technology of China,B.S. Wuhan University
  • Anthony Dowlings (Ph.D. Student, co-mentored with Prof. Ming-Cheng Cheng), M.S./B.S. Clarkson University

Past Students

  • Jiaqian Liu (Undergradaute Student, University of Buffalo, co-mentored with Prof. Daqing Hou), 2021 Summer Research Supported by NSF REU grant
  • Kayla Ruttan (Undergradaute Student, Clarkson University, co-mentored with Prof. Ming-Cheng Cheng), 2020 Summer Research Supported by NSF REU grant
  • Frank Swiatowicz (Undergradaute Student, Vassar College), 2019 Summer Research Supported by NSF REU grant
  • Jhonatan Carbajal Palacios (Undergradaute Student, Rensselaer Polytechnic Institute, co-mentored with Prof. Ming-Cheng Cheng), 2019 Summer Research Supported by NSF REU grant
  • Kiranpreet Birdee (Undergradaute Student, McMaster University), 2017 Summer Research Supported by the Funding from the Government of Canada
  • Boone Tensuda (Ph.D. Student, University of Toronto), 2016 Summer Research Supported by the Funding from the Government of Canada
  • Jacob Siemons (Undergradaute Student, University of Waterloo), 2016 Summer Research Supported by the Funding from the Government of Canada
  • Michael Nishimura (Undergradaute Student, University of Waterloo), 2015 Spring & Summer Research Supported by the Funding from the Government of Canada

Patent

Yu Liu, Liqian Li, Karen Colins, Michael Nishimura, System and Method for Indirectly Monitoring One or More Environmental Conditions (U.S. Patent Number 11,067,710)

Selected Publications

Lin Jiang, Anthony Dowling, Yu Liu, Ming-Cheng Cheng, “Chip-level Thermal Simulation for a Multicore Processor Using a Multi-Block Model Enabled by Proper Orthogonal Decomposition”, 2022 IEEE ITherm Conference, San Diego, CA, USA, 2022.5

Lin Jiang, Anthony Dowling, Yu Liu, Ming-Cheng Cheng, “Exploring and Efficient Approach for Architecture-Level Thermal Simulation of Multi-core CPUs”, IEEE International Symposium on Circuits and Systems (ISCAS) 2022, Austin, Texas, USA, 2022.5

Lin Jiang, Yu Liu, Ming-Cheng Cheng, “An Effective and Accurate Data-Driven Approach for Thermal Simulation of CPUs”, IEEE Itherm 2021, Virtual due to COVID-19, 2021.6

Tao Xu, Yu Liu, Tong Liu, Gang Li, Nusret Aydemir, Multiphysics Modelling of Background Dose by Systemic Targeted Alpha Therapy, Journal of Medical Imaging and Radiation Sciences, Vol. 49, Issue 3, 2018.9

Karen Colins, Liqian Li, Yu Liu, Analysis of a Statistical Relationship between Dose and Error Tallies in Semiconductor Digital Integrated Circuits for Application to Radiation Monitoring over a Wireless Sensor Network, Journal of IEEE Transactions on Nuclear Science, Vol. 64, Issue 5, 2017.5

Yu Liu, Wei Zhang, Scratchpad Memory Architectures and Allocation Algorithms for Hard Real-Time Multicore Processors, Journal of Computing Science and Engineering, Vol. 9, No. 2, 2015.6

Yu Liu, Wei Zhang, Exploiting Multi-level Scratchpad Memories for Time-predictable Multicore Computing, 30th IEEE International Conference on Computer Design (ICCD’12), Montreal, QC, Canada, 2012.10

Last Updated on April 5, 2022 10:30pm EST